ASE Technology Secures Additional Advanced Packaging Orders from Google and Intel

ASE Technology (ASE) has received increased orders for advanced packaging and testing from Google and Intel. Google is expanding its TPU production to support Gemini models and cloud services, with projections indicating mass production by 2028. Meanwhile, Intel is accelerating its EMIB advanced packaging platform, outsourcing assembly and testing to ASE. ASE COO Tien Wu noted that Intel's EMIB and TSMC's CoWoS are not in a zero-sum competition. Due to rising costs in AI chip testing and high demand for advanced packaging, major firms have raised service pr