CoinScoopSamsung Electronics Plans to More Than Double HBM4 and HBM4E Production Next Year
Samsung Electronics (三星电子) aims to at least double its production of HBM4 and HBM4E memory chips in 2025. The company is increasing its outsourced cleaning capacity for glass carriers used in DRAM thinning processes and focusing on high-stack products with 12 or more layers. Industry estimates suggest Samsung's total monthly HBM wafer capacity will rise to approximately 250,000 units, with the HBM4 series expected to account for 80% of its shipments.
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