Samsung Electro-Mechanics proposes MLC technology for AI semiconductor substrates

Kim Sang-hoon of Samsung Electro-Mechanics (Samsung Electro-Mechanics) presented a strategy for Multi-Layer Core (MLC) technology at the KPCA Show 2026 to address the needs of larger, high-layer AI semiconductor packaging. Moving from Single-Layer Core (SLC) to MLC structures improves rigidity and wiring flexibility. The company is exploring hybrid structures and glass cores to manage warping in large-scale packages, aiming to support future high-performance substrates exceeding 40 layers and 120mm in size.