SK Hynix Explores Foundry Processes for 3D DRAM Development

SK Hynix announced that it may utilize foundry processes for the development of next-generation 3D DRAM. During the 2026 SK Hynix Future Forum, executives highlighted that 3D DRAM requires innovations in logic foundry processes for peripheral circuits, data bus bandwidth, and advanced packaging. The company emphasizes that as the boundaries between front-end and back-end processes blur, cross-disciplinary collaboration in materials, devices, packaging, and architecture is essential to overcome scaling limits and power consumption challenges.