Samsung Electro-Mechanics and LG Innotek Pursue Intel EMIB-T Substrate Supply

Samsung Electro-Mechanics and LG Innotek are working to enter the supply chain for Intel's EMIB-T packaging substrates. EMIB-T, an improved version of Intel's Embedded Multi-die Interconnect Bridge, will be used in Google's next-generation TPU AI accelerators starting next year. Samsung Electro-Mechanics is developing samples based on a 2.1D packaging concept, while LG Innotek is conducting tests with SK Hynix to evaluate HBM integration. Current suppliers include Ibiden, Shinko Electric, Unimicron, and AT&S.