CoinScoopTSMC to Begin Mass Production Using ASML High-NA EUV Lithography in 2030
TSMC (Taiwan Semiconductor Manufacturing Company) announced it will adopt ASML's new high-NA EUV lithography machines for mass production starting in 2030. TSMC and ASML will collaborate on industry-wide improvements, including increasing photomask sizes from 6 inches to 12 inches to address the smaller exposure area of high-NA machines. A pilot line for these larger masks is planned by 2031, with full production readiness expected by 2033.
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