JCET Group Plans $910 Million Fundraising to Expand AI Packaging Capacity

JCET Group (长电科技), a leading Chinese semiconductor packaging and testing firm, announced on September 7 plans to raise up to 6.5 billion yuan (approximately $910 million) through a private placement of shares. The funds are earmarked for expanding advanced packaging capacity for AI chips and related R&D. The investment will focus on high-density system-in-package and wafer-level packaging production lines to meet rising demand from clients such as NVIDIA and AMD. The company stated that current capacity is nearing full utilization due to the high bandwidth