Samsung Allocates Over 50% of 4nm Capacity to HBM4 Base Die Production

Samsung Electronics has dedicated more than 50% of its 4nm foundry capacity to the mass production of base dies for sixth-generation HBM4 memory. This strategic shift aims to meet growing supply demands from major clients including NVIDIA, Broadcom, and AMD. Samsung, which began HBM4 shipments in February, expects HBM4 revenue to triple in Q3 and account for over 60% of its total HBM revenue in the second half of the year. The production utilizes Samsung's 4nm (SF4) process, with an estimated monthly wafer input of 15,000 units for HBM4 base dies.