SK Hynix Expands Outsourced Flip-Chip Packaging for Memory Semiconductors

SK Hynix is expanding its outsourced flip-chip packaging operations for memory semiconductors. Following its partnership with OSAT provider A-PROTECH, the company has resumed collaboration with WINPAC after a four-year hiatus. Winpac will handle packaging for certain DDR4 and DDR5 DRAM chips, with production already underway at its P-zone facility. The facility, which handles high-performance products including DRAM, NAND, and eUFS, has increased its monthly capacity from 44 million to 50 million units.