CXMT DRAM production capacity projected to reach 350,000 wafers per month by year-end

Chinese DRAM manufacturer ChangXin Memory Technologies (CXMT) is expected to reach a monthly production capacity of 350,000 wafers by the end of 2026, nearing Micron's projected 375,000. Despite US sanctions limiting access to EUV lithography, the company is utilizing DUV technology and multi-patterning to produce 16Gb DDR5 and LPDDR5X chips. The Chinese government is reportedly encouraging the transfer of DRAM IP to domestic firms.