TSMC accelerates CPO deployment, industry anticipates new Moore's Law

TSMC is accelerating its Co-Packaged Optics (CPO) deployment as traditional copper interconnects reach power and signal transmission limits for high-performance GPUs and ASICs. Industry experts suggest that if CPO bandwidth continues to double every two years, it could establish an 'AI-era CPO Moore's Law.' TSMC is integrating computing, HBM, and high-speed I/O through its 3DFabric, CoWoS, and SoIC technologies. While the industry shifts toward shorter copper paths and longer optical paths, mass production of CPO still requires overcoming challenges in packaging, optical coupling, and testing.