Samsung Electro-Mechanics and Qualcomm Co-Develop 2.1D Organic Bridge Packaging

Samsung Electro-Mechanics and Qualcomm are collaborating on 2.1D organic bridge packaging technology, a project that has been in development and validation for over a year. This technology uses organic materials and substrate processes to connect multiple semiconductor chips within a single package, serving as an alternative to silicon bridges like Intel's EMIB. Samsung Electro-Mechanics is embedding these bridges into FC-BGA substrates to evaluate performance and reliability for Qualcomm's data center chips, with a patent filed in October 2024. The technology targets high-density chip patterns and is being developed in parallel with other clients.