CoinScoopMorgan Stanley: AI Chip Packaging Demand to Remain Strong Through 2028
Morgan Stanley reports that growth for AI semiconductor suppliers is expected to outpace broader cloud spending through 2028, driven by robust demand for advanced chip packaging. The firm projects that total advanced packaging capacity will grow by approximately 50% by 2028, compared to a 12% increase in capital expenditures by cloud service providers.
Summaries are written by AI from the original article. Not investment advice.