Micron Plans to Expand HBM Production Capacity to 100,000 Wafers Per Month by Year-End

Micron Technology plans to double its high-bandwidth memory (HBM) production capacity by the end of this year, aiming for a monthly output of approximately 100,000 wafers. This move is intended to narrow the market share gap with competitors Samsung Electronics and SK Hynix. The company is increasing equipment procurement for its manufacturing facilities in Taiwan and Singapore. Current production is primarily focused on 12-layer HBM3E, with 12-layer HBM4 expected to account for up to 50% of production by year-end. These HBM4 units are designated for Nvidia