DIGITIMES: CPO Bottlenecks Shift from Materials to Packaging and Integration

According to a report by DIGITIMES at the Semicon Network Summit 2026, the silicon photonics industry is facing new bottlenecks in packaging precision and heterogeneous integration rather than materials. Marvell's CTO noted that copper interconnects are reaching physical limits, making end-to-end optical interconnects inevitable. TNO/Holst Centre highlighted the challenge of integrating optical materials like LiNbO3 and InP with CMOS platforms. The Taiwan Semiconductor Industry Association (TSIA) emphasized that packaging now requires micron-level fiber ali