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SK Hynix Begins Construction of $4 Billion Advanced Packaging Plant in Indiana

Crypto Briefing · 2026-08-27 18:06 UTC

SK Hynix has officially broken ground on a $4 billion advanced packaging facility located in Indiana. The company aims to initiate mass production of next-generation HBM4E memory chips at this site by late 2025.

#sk하이닉스
#반도체
#hbm4e
#인디애나

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